Session: 10-01 Interactive Presentations

Paper Number: 100307

100307 - Investigation of Fatigue Life of Epoxy Molding Compounds Under High Temperature Aging Effect 

Dynamic mechanical analysis such as tension test allow study the fatigue failure of polymer materials. By increasing the dynamic strain or stress amplitude the fatigue and failure of material could be characterized. Silica filled epoxy molding compounds are widely used in modern electronic industry, to protect the silicon chip from mechanical, chemical and thermal attack. There is insufficient information on plastic encapsulated electronic components capable of surviving high temperatures for long periods (>100,000 hours). In this paper, the details of the procedure for fatigue effect measurement are described. Feddersen approach for fracture toughness test method is applied. Low cycle fatigue is investigated for pristine samples. The aging effects of a number of epoxy molding compounds subjected to sustained high temperature long term aging have been studied. Two popular molding compounds, EMC-1 and EMC-2 are studied under three aging temperatures: 100C, below glass transition temperature, and 150℃, above glass transition temperature, from pristine to 120 days aging. The crack propagation under constant or increasing stress or strain has been recorded and discussed. A novel set up for fatigue effect measurement is constructed. Feddersen approach for fracture toughness test method is applied. High cycle fatigue are investigated for pristine samples. The aging effects of a number of epoxy molding compounds subjected to sustained high temperature long term aging have been studied. Fatigue properties also dependent on the time effect due to the viscoelasticity. Strain rate effect is also discussed. The crack propagation under constant or increasing stress or strain has been recorded and discussed.

Presenting Author: Yunli Zhang Auburn University