Session: 10-01 Interactive Presentations

Paper Number: 99227

99227 - Performance and Reliability Characterization of Additively Printed Conductive Circuits Due to Cure-Reflow Profile and High-Temperature Operation 

Traditional rigid PCBs have long been the most dependable in the electronics industry, having been utilized in a wide range of applications. In terms of flexible electronics, there hasn't been much research on SMD attachment techniques and process reliability. Because flexible substrates allow for greater flexibility, it's critical to establish a reliable way of attaching components to circuits that can endure a broad range of motion. For component attachment, micro dispensing equipment was utilized to print conductive traces, an electrically conductive adhesive (ECA), and low-temperature solder (LTS). Following sintering of the printed flexible circuits, reflow attachment with LTS and cure-profile for ECAs will necessitate accounting for additional heat exposure. Process recipes will need to account for previous evolution in the electrical, mechanical, and adhesive characteristics of printed circuits. This study looked at the process-performance-reliability relationships for printed conductive adhesive on printed conductive metallization. In order to understand the application-based variation in the printed circuit, the influence of different cure and reflow profiles for component attachment has been investigated.  The interconnects' performance was compared to the COTS established tolerance limits. SEM/EDX was also used to investigate intermetallics at the interface of conductive bonding and additively printed circuits. Intermetallic growth and inverting circuit performance have also been studied after long-term high-temperature exposure.

Presenting Author: Jinesh Narangaparambil Auburn University