Session: 10-01 Interactive Presentations

Paper Number: 99233

99233 - Plastic Work Evolution and High Strain Rate Properties at Extreme Temperatures for SAC-Q Solder Alloy With Extended Durations of High Temperature Aging 

Electronic parts in automotive, aerospace, and military applications are frequently subjected to severe strain rates because of shocks, vibrations, and drop-impact circumstances. These electrical parts are frequently exposed to severe low and high temperatures ranging from -65^oC to 200^oC. Furthermore, in the critical environment, these electronic equipment can be exposed to strain rates ranging from 1 to 100 per second. Mechanical property findings and data for lead-free solder alloys are critical for improving electronic package durability at extreme temperatures and strain rates. Furthermore, thermal ageing can significantly alter the mechanical properties of solder alloys, resulting in microstructure changes. There is a lack of data and findings for the mechanical characteristics of SAC-Q solder alloy that has been isothermally aged for extended periods of time and tested at extreme low to high operating temperatures. In this work, SAC-Q solder material is tested and investigated at working temperatures ranging from -65^oC to 200^oC and at strain rates of up to 75 per second for up 8 months of isothermal aging at temperature of 100^oC. Stress-strain curves for the SAC-Q solder are developed for a wide variety of strain rates and test temperatures. In addition of experimental work, the Anand model constants were determined by predicting the stress-strain behavior recorded for operating temperatures ranging from -65^oC to 200^oC for the solder. For PCB-BGA package assembly, FE analysis was performed for drop/shock events. For varied aging circumstances of SAC-Q solder ball joints, hysteresis stress-strain curves and plastic work density curves are created, compared, and studied for extreme temperature drop/shock events.

Presenting Author: Vishal Mehta Auburn University