Session: 05-04 Phase change cooling technologies

Paper Number: 97486

97486 - The Boiling-Driven Heat Spreader Embedded Device for Thermal Management in High-Power Semiconductor 

Recent developments in microelectronics integration technologies have allowed electronics to be miniaturized but have made heat dissipation of the semiconductor difficult instead. So, the latest thermal management devices for high-power electronics require high heat dissipation performance of over 100 W/cm². A new concept of passive heat spreader (boiling-driven heat spreader) that works by the boiling heat transfer was presented with reliable thermal management performances even at high heat flux conditions. In addition, the boiling-driven heat spreader is easier to be fabricated than a typical vapor chamber because of the simple internal design. In this study, a new thermal packaging embedded with a boiling-driven heat spreader is designed, fabricated, and evaluated for its thermal performance. The heat sink of the thermal packaging consists of a 3 mm base plate with a boiling-driven heat spreader and a circular pin fin array which is identically the same as one of the HybridPACK^TM 2 of Infineon. With the microporous structure of the heat sources, nucleation cavities are formed, and boiling can be enhanced. Consequently, bubble pumping could transport the working fluid in the boiling-driven heat spreader. The fabricated heat sink can dissipate 500 W of concentrated heat with a relatively low junction temperature of 77 ℃. As a result, boiling-driven heat spreaders can perform the thermal management of high-power heat sources and enhance the cooling capability.

Presenting Author: Hyunmuk Lim Ajou University