[Skip to Content]

Important Updates

InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and
heterogeneous integration. It is a flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on
Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power
Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions
between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2024 will include panel discussions,
workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.

InterPACK2024 Tracks:

  • Track 1: Heterogeneous Integration
  • Track 2: Data Centers and Modular Edge Systems
  • Track 3: Electronics Packaging
  • Track 4: Power/RF Electronics and Photonics
  • Track 5: Multiscale Thermal Transport and Energy Storage
  • Track 6: Flexible, Wearable, and Printed Electronics
  • Track 7: Transportation Systems, AI and Machine Learning
  • Track 8: Interactive Presentations
  • Track 9: Panels, Tutorials, and Workshops


Submit an Abstract