InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is a flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2024 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.
InterPACK2025 Tracks:
- Track 1: Heterogeneous Integration
- Track 2: Data Centers and Modular Edge Systems
- Track 3: Electronics Packaging
- Track 4: Power/RF Electronics and Photonics
- Track 5: Multiscale Thermal Transport and Energy Storage
- Track 6: Flexible, Wearable, and Printed Electronics
- Track 7:Transportation Systems, AI and Machine Learning
- Track 8: Interactive Presentations
- Track 9: Micro/Nano Mechatronics, Microelectromechanical Systems and their Applications to Internet of Things
- Track 10: Mechatronics, Tribology, and Control of Information Storage Systems and Robotics
- Track 11: Advanced Simulation in Science and Engineering
- Track 12: Panels, Tutorials, and Workshops