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InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Since 1992, InterPACK has been a premier international conference for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics and photonics packaging and heterogeneous integrated systems. InterPACK is a flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The international nature of InterPACK has been highly beneficial in promoting synergy between industry, government, and academia. In addition to technical presentations and exhibitions, InterPACK 2023 will include plenary talks, panel discussions, tutorials, workshops, and an interactive presentations session held along with a career networking event.

InterPACK2023 Tracks:

  • Track 1: Heterogeneous Integration
  • Track 2: Electronics Packaging
  • Track 3: Multiscale Thermal Transport and Energy Storage
  • Track 4: Digital Technologies (AI, ML) in Microelectronics
  • Track 5: Data Centers and Modular Edge Systems
  • Track 6: Power/RF Electronics and Photonics
  • Track 7: Flexible, Wearable, and Printed Electronics 
  • Track 8: Interactive Presentations


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