Session: 08-01 Mini-Symposium for Professor Dasgupta I

Paper Number: 94356

94356 - Vibration Durability of Low-Profile Quad Flat Package (Lqfp) Interconnects 

Electronic assemblies can be exposed to severe vibration loading conditions in their life cycle for some applications. There are many studies on the reliability of electronic packages under vibration excitation. This study focuses on the effect of the interconnect and PWA architecture, including the effect of using reduced solder pads.  It was discovered that, for short light components such as Low-profile Quad Flat Packages (LQFP) mounted on printed circuit board (PCB), the vibration durability could be affected by multiple factors, including package size, package thickness, excitation profiles, package location on the PWB, the fixturing scheme for the PWA, solder pad architecture, etc.

This study combines random vibration testing and finite element modeling (FEM) to examine the performance of gull wing leads in LQFP packages under different vibrational loading conditions. An electrodynamic shaker is used to perform vibration tests on LQFP-PWAs with different excitation magnitude along the out-of-plane direction. The influence of interconnect architecture on package durability is of interest. Multi-scale global-local finite element models are used to verify testing results and to provide insights into interconnect stresses and strains in response to the vibration excitation.  Modeling methods use both time-domain approach and frequency-domain approach for comparison. The findings of this study could provide design guidelines for electronic packages and systems that need to survive vibrational conditions, and also shows the importance of interconnect reliability testing in the field. This data will also serve as a benchmark later for multiaxial vibration durability study.

Presenting Author: Xiao Lin University of Maryland College Park