Track 1 – Wining Road to Maximize System Performance

Keynote Speaker: Gamal Refai-Ahmed, PhD, LFASME, FIEEE, FCAE, FEIC, Sr Fellow AMD
Moderator: Prof Amanie Abdelmessih, California Baptist University and Dr Timothy Chainer, IBM

As technology nodes shrink and power density increases, thermal issues become more challenging and need to be addressed with innovative solutions. In this presentation we highlight the path finding to maximize the system performance. In this talk a roadmap and a pathfinding is presented. Furthermore, the presentation is disclosing key factors which needs to be considered in developing present and next generation of thermo-mechanical solutions. These factors are: enabling and working on/around manufacture infrastructure, accommodating future heterogeneous integration, utilizing current/future infrastructure of board level manufactured assembly, addressing the solution from system level, extending air cooling, enabling liquid cooling, and considering immersion liquid cooling. Based on these factors, a Path finding strategy will be built on four elements/pillars which are hosting facilities, driving ecosystems, defining cost based on operating condition and reliability, and synergistic management of workload in both IT equipment and cooling systems.

Dr. Gamal Refai-Ahmed, Life Fellow ASME, Fellow IEEE, Fellow Canadian Academy of Engineering, Professional Engineer Ontario, is AMD Senior Fellow. He obtained the Ph. D. degree from the University of Waterloo.

He has been recognized as one of the global technical leaders through his numerous publications (more than 120 publications) and patents& patents pending US (more than 65) and International (more than 110). His contributions are clearly seen in several generations of both GPU, CPU and FPGA for HPC, AI, ML, NIC, Game Console, Aerospace& Defense and Telecom products.

In 2015, Gamal was tasked to initiate the heterogeneous integration of system level power, thermal, mech and assembly with package and Si development in first initial planning. He has been a key player to introduce all Alveo products and high-end Si CoWos, InFo, Chiplets PKG to AMD Customers. He was behind the introduction of the first Lidless FPGA 20, 16, 7nm technology nodes with highest warpage in mass production in Alveo products, and its Telecom, AI, HPC customers (e.g. MSFT, AWS, Nokia, Cisco and A&D). his developed strategy of technology enable AMD FPGA products to outperform the Intel/Altera Products.

Gamal is the recipient of 2008 excellent thermal management award, 2010 Calvin Lecture and 2013 K16- Clock award in recognition for his scientific contributions and leadership of promoting best electronics packaging engineering practice. In 2014, Gamal received the IEEE Canada R. H. Tanner Industry Leadership for sustained leadership in product development and industrial innovation. In 2016, ASME awarded Gamal the ASME Service Award. State University of New York, Binghamton University awarded him the Innovation Partner Award for his industrial role with Binghamton University. In continuation to Dr Refai contributions to the best engineering practice, State University of New York at Binghamton awarded him the Presidential University medal in 2019 which is the highest recognition honor by the university. In 2021, Gamal was elected to IEEE Fellow and EIC Fellow.