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October 25, 2022, 10:15 AM - 11:45 AM

Presentations

Note: Presentations may start a few minutes before the time listed in the schedule.

Participant RoleDetailsAction
SubmissionThermomechanical Reliability of BGA Packages With Different Underfill Reinforcement MethodsView
SubmissionStudy of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure LoadingView
SubmissionA Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder JointsView
SubmissionEffects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 SolderView

08-04 Interconnections

Description

This session focuses on the reliability of electronic interconnections.