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October 25, 2022, 5:30 PM - 7:00 PM
Presentations
Note: Presentations may start a few minutes before the time listed in the schedule.
| Participant Role | Details | Action |
|---|---|---|
| Submission | Evaporative/boiling Wick Cooling Using Laser-Induced Graphene for Flexible Electronics | View |
| Submission | Numerical Prediction of Visualization and Temperature Distribution of Two Phase Closed Thermosyphon With Openfoam | View |
| Submission | A Magnitude Modulated Thermoreflectance Technique for Measurements of Thermal Resistance and Heat Capacity of Thin Films and Bulk Materials | View |
| Submission | Multimodal Prediction for Flow Boiling Heat Transfer | View |
| Submission | Crystalline-Like Thermal Transport in Disordered Interfacial Thin Films | View |
| Submission | Plastic Work Evolution and High Strain Rate Properties at Extreme Temperatures for SAC-Q Solder Alloy With Extended Durations of High Temperature Aging | View |
| Submission | Evolution of High Strain Rate Mechanical Properties of SAC+Bi Solders After 120 Days of 50°c Isothermal Aging | View |
| Submission | Effect of Temperature Exposure on Performance of Inkjet Printed Circuits With Surface Mount Components | View |
| Submission | Print Parameter Prediction Using Deep Learning Technique to Achieve Realized Electrical Performance and Geometry on Ink-Jet Platform | View |
| Submission | Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center | View |
| Submission | Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations | View |
| Submission | Simultaneous High-Speed Visual and Infrared Measurements for Tracking Dryspots During Boiling Crisis | View |
| Submission | Materials Characterization for Thermally Aged Snagcu Solder Alloys and Drop & Shock Simulation Using Input-G Method | View |
| Submission | Characterization of Viscoelastic Properties of Underfills and Effect on Reliability of Fcbga Package Exposed to High Operating Temperature | View |
| Submission | Interfacial Damage Mechanics at Fcbga Chip-Underfill Interfaces Under Thermo-Mechanical Loading for Automotive Underhood Applications | View |
| Submission | Performance and Reliability Characterization of Additively Printed Conductive Circuits Due to Cure-Reflow Profile and High-Temperature Operation | View |
| Submission | Evolution of Interfacial Mechanics Due to Isothermal Exposure at the Substrate-Potting Compound Interfaces Under Monotonic and Fatigue Loading | View |
| Submission | Estimation of State of Health Degradation of Thin Flexible Li-Ion Batteries Subjected to Accelerated Life Cycling With Randomized Levels of Charge-Discharge and Varying C-Rates | View |
| Submission | Characterization of Additively Printed Humidity Sensor With Super Capacitive Material Using Real-Time Artificial Neural Network Calibration and Multi-Physics Simulation for Wearable Astro-Sensor Device | View |
| Submission | A Thin-Film Sic Thermal Test Chip for Reliability Monitoring in Harsh Environment | View |
| Submission | Dual Converging Jets for Enhanced Liquid Impingement Cooling | View |
| Submission | Varied Phase Change Material Properties for Increased Melt Front Velocity and Heat Transfer Efficiency | View |
| Submission | Prediction of the Effects of Structural Parameters on Overall Properties of Sac Lead Free Solder Alloys | View |
| Submission | Effect of Isothermal Aging on the Evolution of Local Microscale Mechanical Properties Within Sac305 and Sac+bi Solders | View |
| Submission | Mechanical Property Evolution in Thermally Cycled Sac+bi Lead Free Solders | View |
| Submission | Evolution of the Creep Behavior of Sac305 Solder Due to Damage Accumulation | View |
| Submission | Electro-Chemical Migration (Ecm) in Aerosol-Jet Printed Electronics Using Temperature-Humidity (Th) and Water Droplet (Wd) Testing | View |
| Submission | An Experimental Study on Two-Phase Flow Boiling in Compressed Metallic Foams for Advanced Thermal Management of High Heat Flux Electronics | View |
| Submission | Investigation of Fatigue Life of Epoxy Molding Compounds Under High Temperature Aging Effect | View |
| Submission | A Novel Approach to Reliability Assessment of 2nd Level Underfill in Bga Packages | View |
| Submission | Thin Flat Boiling-Driven Heat Spreader | View |
| Submission | Magnesium Doping Enhances Thermal Conductivity of Polymerized Fullerene Crystals | View |
| Submission | Drop Durability of Printed Hybrid Electronic (Phe) Assemblies Under Extreme Acceleration Level | View |
| Submission | Cfd Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server | View |
| Submission | Thermal Conductivity Switch Due to Topochemical Polymerization of Organic Material | View |
| Submission | Combined Voltage Shielding Capacity of Dielectric Fluids and Dielectric Surface Coatings | View |